Core I — Electronics

Research on electronic circuits, systems, signal processing, instrumentation, embedded computing, and control technologies.

1.1 Electronic Circuits and Systems

Analog and digital circuits, mixed-signal systems, power electronics, electronic system design, and low-power electronic technologies.

1.2 Electronic Measurement and Instrumentation

Electronic measurement, instrumentation, data acquisition, calibration, testing, diagnostics, and monitoring systems.

1.3 Embedded and Computing Systems

Embedded systems, microcontrollers, real-time computing, hardware–software co-design, FPGA-based systems, and IoT devices.

1.4 Digital Signal and Image Processing

Digital signal processing, audio and speech processing, speech enhancement and denoising, speech separation, image and video processing, and multimedia quality assessment.

1.5 Intelligent Electronics and Control

Electronic control systems, automation, robotics, intelligent electronics, fault diagnosis, condition monitoring, and system reliability.

Core II — Telecommunications

Research on communication theory, wireless and optical systems, telecommunication networks, antennas, and signal transmission.

2.1 Communication Theory and Techniques

Analog and digital communications, modulation, synchronization, signal detection, channel estimation, equalization, and performance analysis.

2.2 Source and Channel Coding

Source coding, data compression, error-control coding, decoding, information theory, and joint source–channel coding.

2.3 Communication Protocols and Architectures

Communication protocols, network architectures, medium access control, resource allocation, cross-layer optimization, and quality of service.

2.4 Wireless and Mobile Communications

Wireless and cellular systems, vehicular communications, intelligent transportation systems, OFDMA, NOMA, massive MIMO, beamforming, and next-generation wireless technologies.

2.5 Telecommunication Networks

Network performance and management, software-defined networking, network function virtualization, network security, resilience, and IoT communication networks.

2.6 Software-Defined and Cognitive Radio

Software-defined radio, cognitive radio, dynamic spectrum access, spectrum sensing, and adaptive communication systems.

2.7 Optical Communications

Optical fiber systems, optical transmission and networking, free-space optical communications, and photonic communication systems.

2.8 RF, Microwave, and Millimeter-Wave Communications

RF and microwave systems, millimeter-wave and terahertz communications, RF components, and propagation characterization.

2.9 Satellite Communications and Broadcasting

Satellite communication systems, space-based networks, digital broadcasting, and broadcast transmission technologies.

2.10 Radar, Sonar, and Sensing

Radar and sonar systems, remote sensing, target detection, signal estimation, wireless sensing, and integrated sensing and communication.

2.11 Navigation and Positioning

Satellite navigation, indoor and outdoor localization, positioning algorithms, and navigation signal processing.

2.12 Antennas and Propagation

Antenna design, antenna arrays, beamforming, radio-wave propagation, channel modeling, and propagation measurement.

2.13 Electromagnetic Compatibility

Electromagnetic compatibility, interference, emission and susceptibility, interference mitigation, and electromagnetic testing.

Core III — Microelectronics

Research on semiconductor devices, integrated circuits, electronic materials, microsystems, fabrication, packaging, and reliability.

3.1 Microelectronic Devices and Systems

Semiconductor devices, electronic components, device modeling, characterization, performance evaluation, and reliability.

3.2 ASIC, SoC, and Integrated Circuit Technologies

ASICs, system-on-chip design, analog and digital ICs, mixed-signal circuits, verification, testing, and low-power IC design.

3.3 Electronic Materials

Semiconductor materials, functional electronic materials, advanced materials, and material characterization for electronic devices and sensors.

3.4 MEMS and Microsystems

MEMS, microsystem design and integration, microactuators, microstructures, fabrication, and characterization.

3.5 Sensors and Microsensors

Microelectronic sensors, physical and chemical sensors, biosensors, sensor interfaces, readout circuits, and integration.

3.6 Semiconductor Fabrication

Semiconductor processing, lithography, etching, deposition, process integration, and manufacturing optimization.

3.7 Advanced and Emerging Fabrication Technologies

Advanced semiconductor technologies, nanofabrication, nanoscale devices, emerging device structures, and novel fabrication techniques.

3.8 Packaging, Integration, and Reliability

Electronic packaging, interconnects, heterogeneous integration, chiplets, thermal management, reliability assessment, and failure analysis.

Core IV — Artificial Intelligence and Intelligent Systems

This cross-disciplinary core covers AI methods and intelligent systems that advance electronics, telecommunications, and microelectronics.

4.1 Artificial Intelligence and Machine Learning

Machine learning, supervised and unsupervised learning, reinforcement learning, deep learning architectures, explainable AI, robust AI, and model optimization.

4.2 AI for Telecommunications

AI-enabled communication systems, intelligent wireless communications, radio resource management, channel estimation, signal detection, network optimization, spectrum sensing, and communication security.

4.3 AI for Electronics and Signal Processing

Embedded AI, intelligent electronic systems, AI-assisted signal and image processing, deep-learning-based speech enhancement, speech denoising, noise suppression, audio processing, intelligent instrumentation, and AI-based control.

4.4 AI for Microelectronics and Semiconductor Technologies

AI-assisted IC design, semiconductor process modeling, device characterization, intelligent manufacturing, process monitoring, chip testing, and reliability prediction.

4.5 Intelligent Systems and Edge AI

Edge AI, efficient machine learning, hardware–software co-design, AI accelerators, neuromorphic computing, embedded intelligence, real-time inference, and federated learning.

4.6 AI Applications and Emerging Technologies

Multimodal AI, generative AI for engineering, anomaly detection, predictive maintenance, data-driven modeling, intelligent optimization, and emerging AI methods for electronics, telecommunications, and microelectronics.